KAGA FEI’s WKI611AA1 Wi-Fi 6 and Bluetooth 5.4 combo module simplifies the development of low-power embedded devices. With a built-in antenna and multiple certifications, it reduces antenna development time and certification costs for applications such as industrial automation, IoT gateways, surveillance cameras, and smart home appliances.
The WKI611AA1 module employs NXP Semiconductor’s IW-611, a highly integrated dual-band 2.4/5-GHz 1×1 Wi-Fi 6 and Bluetooth/Bluetooth Low Energy 5.4 chip. Its Wi-Fi subsystem includes a Wi-Fi MAC, baseband, and direct-conversion radio with an integrated power amplifier, low-noise amplifier, and transmit/receive switch, eliminating the need for an external RF front-end module. The chip’s independent Bluetooth subsystem supports Bluetooth profiles.
Dedicated CPUs and memories for both the Wi-Fi and Bluetooth subsystems enable real-time, independent protocol processing. Interfaces to external host processors include SDIO 3.0 for Wi-Fi and UART for Bluetooth.
The WKI611AA1 module comes in an LGA surface-mount package that is 25.0×15.7×2.1 mm. It operates from a 3.3-V/1.8V power supply over a temperature range of -40°C to +85°C. Certifications for the combo module include Radio Law MIC (Japan), FCC (USA), and ISED (Canada).
The WKI611AA1 wireless combo module will be available for sampling in December 2024, with mass production slated to begin in May 2025.
Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.
The post Wireless combo module targets embedded devices appeared first on EDN.