A Bluetooth LE 5.4 module, the HCM511S from Quectel, leverages the power of an Arm Cortex-M33 core, along with 352 or 512 kbytes of flash memory. The module, which also provides 32 kbytes of RAM, brings efficient performance to compact connected devices such as digital keys, portable medical devices, and battery-operated motion sensors.
According to Quectel, the Bluetooth module’s transmit power of +6 dBm achieves long-distance transmission, allowing low-power devices to connect cost effectively. Optional support for Bluetooth mesh nodes increases network scalability and allows greater device density over a mesh topology. The HCM511S also offers up to 18 GPIOs, which can be multiplexed for various interfaces, including ADC, USART, I2C, I2S, PDM, SPI, and PWM.
The MCU Bluetooth module comes in a 16.6×11.2×2.1-mm LCC package and weighs just 0.57 g. It operates over a temperature range of -40°C to +85°C. In addition to being certified by the Bluetooth Special Interest Group, the HCM511S is also certified for use in Europe, America, Canada, China, Australia, and New Zealand.
Engineering samples of the HCM511S MCU Bluetooth module are available now.
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